Trocellen presents its revolutionary solutions in adhesive tapes
Trocellen is attending Bondexpo 2014 – the large scale international trade fair for bonding technology – for the first time. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, Bondexpo provides framework for meeting and understanding the full range of new opportunities in the industry.
Bondexpo 2014 will take place from October 6th to 9th at Neue Messe Stuttgart, Germany.
Come and meet Trocellen’s useful, high quality solutions for the real needs of the business and the environment.
Please visit us at the Bondexpo in Hall 7 – Booth 7505.